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Apparatuses and Methods for Transferring and Bonding Substrates:

U.S. Patent No. 9,775,748

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By: Karen McIntyre

Editor, Nonwovens Industry

Uwe Schneider, Cincinnati, OH; Michael Devin Long, Springfield Township, OH; and David C. Ordway, Oxford, OH.
Assigned to The Procter & Gamble Company, Cincinnati, OH.

Filed: 1/25/16
Issued: 10/3/17

A method for forming a bond, the method comprising the steps of: advancing a substrate assembly in a machine direction at a first velocity, wherein the substrate assembly comprises a process product pitch defined by a leading portion and a trailing portion, and wherein the substrate assembly comprises a first substrate and a second substrate; rotating a bonder apparatus about an axis of rotation, wherein the bonder apparatus comprises a support surface between each of a first member and a second member adjacent the first member, wherein each of the first and second members comprise a proximal end portion adjacent the axis of rotation and a distal end portion opposite the proximal end portion; rotating the first member about the axis of rotation at the first velocity, wherein the first member comprises a first receiving surface positioned at the distal end portion of the first member; rotating the second member about the axis of rotation at the first velocity, wherein the second member comprises a second receiving surface positioned at the distal end portion of the second member, wherein the first member and the second member are separated by an initial angle; receiving the leading portion on the first receiving surface of the first member; receiving the trailing portion on the second receiving surface of the second member; decelerating the first member to a second velocity; decelerating the second member to the second velocity; positioning the first member and the second member such that the first member and the second member are separated by a process angle, wherein the process angle is different than the initial angle; maintaining the position of a portion of the leading portion and the trailing portion of the substrate assembly on the surface of the first and second members; bonding at least a portion of the substrate assembly, wherein each of the first receiving surface and the second receiving surface define a fluid aperture, and wherein jets of heated fluid pass through the fluid apertures toward the substrate assembly; accelerating the first member to the first velocity; and accelerating the second member to the first velocity.

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